Instructordigisi
TypeOnsite Course
Seat0/0
PriceRp. (Hubungi Kami)
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The Basic Knowledge of Surface Mount Technologies apply in PCBA ( Panel Circuit Board Assembly )

Target Audience

  • Section Heads and Department Managers
  • Supervisor
  • Engineer

Course Objective

  • Enhance Quality of Solder Deposition
  • Improve Reflow Process Yield
  • Understand Solder Joint Metallurgy
  • Knowledge of Latest Developments
  • Advanced packages and attachment processes

Course Content

  • Industry Direction, Driving Factors and Process Overview
  • Solder Paste Characterization, Qualification and control
  • Solder Paste Deposition, Pad Layout Design and Printer Control
  • Reflow Soldering and Perfecting Thermal Profiling
  • Component Placement Systems
  • Solder Joint Quality and Reliability
  • New Developments and Lead Free Soldering
  • SMT Rework Processes